SEMI Stds




		Standards Status


	Phone: 650-961-5900 FAX: 650-323-9237 E-Mail: info@thermengr.com Santa Clara, CA, USA


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	SEMI Standards (Developed by US and Japanese Committees/Task Forces)

G30-88	SEMI Test Method: Junction-to-Case Thermal Resistance Measurments of Ceramic Packages
G32-87	SEMI Guidline: Unencapsulated Thermal Test Chip
G38-87	SEMI Test Method: Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages Â Â (Replaced by G38-96)
G42-96	SEMI Specification: Thermal Test Board Standardization for Measuring Junction-to- Ambient Thermal Resistance of Semiconductor Packages
G43-87	SEMI Test Method:Â Junction-to-Case Thermal Resistance Measurements of Molded-Plastic Packages
G46-88	SEMI Test Method: Thermal Transient Testing for Die Attachment Evaluation of Integrated Circuits
G38-96	SEMI Test Method:Â Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages
G42-96	SEMI Specification: Thermal Test Board Standization for Measuring Junction-to- Ambient Thermal Resistance of Semiconductor Packages
G68-96	SEMI Test Method: Junction-to-Case Thermal Resistance Measurements in Air Environment for Semiconductor Package


	To obtain copies of these documents, please click on the linked standard number, visit the SEMI web site or contact:


	SEMI - USA 3081 Zanker Road San Jose, CA 95134 USA Tel: 1.408.943.6900 Fax: 1.408.428.9600 Email: semihq@semi.org


	SEMI - Japan 7F Kenwa Building 4-7-15 Kudan-miniami Chiyoda-ku Tokyo 102, Japan Tel: 03-3222-5755 FAX: 03-3222-5757


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	SEMI - Europe Avenue des Arts 40 Brussels, B-1040 Belgium Tel: 32.2.289.6490 Fax: 32.2.511.4345 Email: semieurope@semi.org

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